Patent Number: 6,251,768

Title: Method of arranging the staggered shape bond pads layers for effectively reducing the size of a die

Abstract: A method of arranging staggered bond pads layers for effectively reducing the size of a die. The sizes of different bond pad layers are reduced gradually from the upper layer to the lower layer, while the sizes of traces in different layers are increased from the upper layer to the lower layers. The size of the first layer is specified and determined by the specification of a wire bonder. The reduction of different bond pad layers may be linear or nonlinear.

Inventors: Lin; Wei Feng (Taipei, TW)

Assignee: Silicon Integrated Systems Corp.

International Classification: H01L 21/02 (20060101); H01L 23/485 (20060101); H01L 23/48 (20060101); H01L 21/60 (20060101); H01L 021/44 ()

Expiration Date: 06/26/2018