Patent Number: 6,251,810

Title: Composite solder glass, filling material for same and methods of using same

Abstract: An improved filling material for a composite solder glass based on doped PbTiO.sub.3 is disclosed, in which up to 35 atom % of the Pb atoms and up to 35% Ti atoms are replaced by Mg and/or Ca and a portion of O atoms in the doped PbTiO.sub.3 is replaced with halogen atoms, preferably fluorine atoms. This filling material and composite solder glasses containing it are useful for hermetic sealing, soldering and/or coating of individual components made of glass material, glass-ceramic material, ceramic material and metal in the manufacturing of components and devices for electrical engineering and electronics, for hermetic encapsulation of electronic components, vacuum-tight seals or closures of display tubes or for display devices. They are also useful for coating and bonding of special glasses. The filling material can be made by reaction sintering of a powder mixture at temperatures of C. to C.

Inventors: Siebers; Friedrich (Nierstein, DE), Mund; Dietrich (Obersussbach, DE), Paschke; Hartmut (Ergolding, DE), Beudt; Hans-Werner (Wiesbaden, DE)

Assignee: Schott Glas

International Classification: C04B 35/49 (20060101); C04B 35/472 (20060101); C04B 35/462 (20060101); C04B 35/491 (20060101); C04B 35/493 (20060101); C03C 14/00 (20060101); C03C 1/00 (20060101); C03C 8/20 (20060101); C03C 8/00 (20060101); C03C 1/10 (20060101); C03C 8/24 (20060101); C03C 8/12 (20060101); C03C 8/10 (20060101); C03C 008/12 ()

Expiration Date: 06/26/2018