Patent Number: 6,251,978

Title: Conductive composite material

Abstract: A conductive net-shape moldable molding composition, with a thermal conductivity above 22 W/ and a volume electrical resistivity of 0.1 ohm-cm or lower and a surface electrical resistivity of 1.0 ohm or lower, is provided. The thermally and electrically conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Inventors: McCullough; Kevin A. (Warwick, RI)

Assignee: Chip Coolers, Inc.

International Classification: C08K 3/00 (20060101); C08K 7/00 (20060101); C08K 003/38 (); C08K 003/22 (); C08K 003/10 (); C08K 003/04 ()

Expiration Date: 06/26/2018