Patent Number: 6,252,010

Title: Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device

Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Inventors: Takeuchi; Kazumasa (Yuki, JP), Saito; Tetsuya (Shimodate, JP), Nanaumi; Ken (Shimodate, JP)

Assignee: Hitachi Chemical Company, Ltd.

International Classification: B32B 15/08 (20060101); C08L 79/00 (20060101); C08G 18/34 (20060101); C08L 79/08 (20060101); C09D 183/10 (20060101); C09J 7/02 (20060101); C09J 179/00 (20060101); C08L 63/00 (20060101); C08G 18/00 (20060101); C09J 179/08 (20060101); H01L 21/02 (20060101); C08G 18/61 (20060101); C08G 18/32 (20060101); H01L 23/28 (20060101); H01L 23/498 (20060101); H01L 23/29 (20060101); H01L 21/58 (20060101); H01L 23/48 (20060101); C08L 083/08 (); C08G 077/26 ()

Expiration Date: 06/26/2018