Patent Number: 6,252,029

Title: Hydroxyphenyl group-containing organosilicon compound, and method for manufacturing same

Abstract: This invention relates to a hydroxyphenyl group-containing organosilicon compound of the formula: ##STR1## where X is an alkenyl group; Z is a phenylene group or a carbonyloxy group expressed by --C(O)O-1, Y is a substituted or unsubstituted hydroxyphenyl group, R.sup.1 is a hydrocarbon group with two or more carbon atoms, with the various groups being the same or different, R is a monovalent hydrocarbon group containing no aliphatic unsaturated bonds, A is a divalent hydrocarbon group with one or more carbon atoms or a group expressed by the formula --R.sup.2 --O--R.sup.2 -- where R.sup.2 is a divalent hydrocarbon group, m and p are 0 or 1, n is a number from 0 to 2, and q is an integer from 0 to 7. These compounds are useful in curable organosiloxane compositions.

Inventors: Amako; Masaaki (Chiba Prefecture, JP), Okawa; Tadashi (Chiba Prefecture, JP)

Assignee: Dow Corning Toray Silicone Co. Ltd.

International Classification: C07F 7/08 (20060101); C07F 7/00 (20060101); C08G 77/00 (20060101); C08G 77/04 (20060101); C08G 077/20 ()

Expiration Date: 06/26/2018