Patent Number: 6,252,033

Title: Method for the preparation of polyamic acid and polymide useful for adhesives

Abstract: A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization. ##STR1##

Inventors: Kweon; Jeong Min (Kyunggi-Do, KR), Kim; Soon Sik (Seoul, KR), Chang; Kyeong Ho (Seoul, KR), Lee; Kyung Rok (Seoul, KR)

Assignee: Saehan Industries Incorporation

International Classification: C08G 73/00 (20060101); C08G 73/10 (20060101); C08G 77/00 (20060101); C08G 77/455 (20060101); C08G 073/10 (); C08G 069/26 (); C08G 077/04 (); C08L 079/08 ()

Expiration Date: 06/26/2018