Patent Number: 6,252,725

Title: Semiconductor micro epi-optical components

Abstract: A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56). The method may optionally include the step of removing the photoresist mask from each of the optical columns prior to polishing the optical columns, as well as the step of depositing an antireflectivity coating onto each of the optical components.

Inventors: Tran; Dean (Westminister, CA), Anderson; Eric R. (Redondo Beach, CA), Strijek; Ronald L. (Vista, CA), Rezek; Edward A. (Torrance, CA), Rochin; Luis M. (Oxnard, CA)

Assignee: TRW Inc.

International Classification: G02B 6/122 (20060101); G02B 6/42 (20060101); H01L 33/00 (20060101); H01L 31/18 (20060101); G02B 6/12 (20060101); G02B 007/02 (); H01L 023/58 ()

Expiration Date: 06/26/2018