Patent Number: 6,252,758

Title: Method for reducing particles from an electrostatic chuck and an equipment for manufacturing a semiconductor

Abstract: A method for reducing particles from an electrostatic chuck, having the steps of: setting a wafer onto an attracting face of an electrostatic chuck, attracting the wafer onto the attracting face by applying a voltage to the electrostatic chuck, releasing stress due to a difference in heat expansion between the wafer and the electrostatic chuck by sliding the wafer relative to the attracting face before the wafer's temperature arrives at a saturated temperature, and increasing the wafer's temperature to a saturated temperature from its lower temperature than that of the attracting face.

Inventors: Nagao; Mie (Chita, JP), Ushikoshi; Ryusuke (Tajimi, JP), Ohno; Masashi (Nagoya, JP)

Assignee: NGK Insulators, Ltd.

International Classification: G03F 7/20 (20060101); H01L 21/683 (20060101); H01L 21/67 (20060101); H02N 13/00 (20060101); H01L 021/68 (); H02N 013/00 (); B23Q 003/15 ()

Expiration Date: 06/26/2018