Patent Number: 6,252,777

Title: IC card and its frame

Abstract: An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching. The plane coil 10 in which a conductor line 11 is wound a plurality of times in substantially the same plane is formed by punching, terminals 10a, 10b of the plane coil 10 and electrode terminals 12a, 12b of the semiconductor element 12 are electrically connected to each other, the plane coil 10 is provided with an outside terminal 10a formed outside the coil and an inside terminal formed inside the coil, the semiconductor element 12 is arranged in such a manner that a forming face on which the electrode terminals 12a, 12b are formed or a plane reverse to the forming face is opposed to the conductor line 11 of the plane coil 10, the electrode terminals 12a, 12b of the semiconductor element 12 are respectively located adjacent to the outside terminal 10a and the inside terminal 10b of the plane coil 10, and the electrode terminals 12a, 12b are electrically connected to the terminals 10a, 10b of the plane coil 10 located on the same side with respect to the inside and outside of the coil.

Inventors: Ikeda; Takashi (Nagano, JP), Akagawa; Masatoshi (Nagano, JP), Ito; Daisuke (Nagano, JP)

Assignee: Shinko Electric Industries Co., Ltd.

International Classification: G06K 19/077 (20060101); H05K 001/14 ()

Expiration Date: 06/26/2018