Patent Number: 6,253,755

Title: Method for reducing damage to wafer cutting blades during wafer dicing

Abstract: A method of dividing a semiconductor wafer into dice, wherein the semiconductor wafer has a circuit side, an underside, and at least one street index that defines the dice, is disclosed. The method includes placing the underside of the wafer on a support having a surface and at least one recess in the surface corresponding to the at least one street index of the wafer, aligning the street index of the semiconductor wafer with the at least one recess in the surface, and dividing the semiconductor wafer along the at least one street index.

Inventors: Wark; James M. (Boise, ID), Akram; Salman (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: B28D 5/00 (20060101); B28D 001/02 ()

Expiration Date: 07/03/2018