Patent Number: 6,253,758

Title: Apparatus for reducing damage to wafer cutting blades during wafer dicing

Abstract: An apparatus for dicing a semiconductor wafer having a circuit side, an underside, and a street index that defines dice on the semiconductor wafer is disclosed. The apparatus includes a support having a surface for supporting the underside of the semiconductor wafer and at least one recess in the surface corresponding to the street index of the semiconductor wafer.

Inventors: Wark; James M. (Boise, ID), Akram; Salman (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: B28D 5/00 (20060101); B28D 007/04 ()

Expiration Date: 07/03/2018