Patent Number: 6,253,836

Title: Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus

Abstract: A notebook computer has a base housing with a heat-generating microprocessor therein, and a lid housing pivotally connected to the base housing. Operating heat from the microprocessor is transferred to the lid housing, for dissipation therefrom, via a specially designed thermosyphoning heat pipe structure formed from first and second heat pipes. The first heat pipe representatively has a rectangular cross-section, an evaporating portion thermally communicated with the microprocessor, and a coiled condensing portion centered about the lid hinge line and having a circularly cross-sectioned interior side surface portion defined by flat sides of the first heat pipe. The second heat pipe has a circular cross-section, an evaporating portion pivotally received within the coiled first heat pipe portion, and a condensing portion thermally communicated with the lid housing. When the lid housing is opened and closed, the evaporating portion of the second heat pipe is rotated within the coiled first heat pipe portion and slidably engages its circularly cross-sectioned interior side portion.

Inventors: Mitchell; Nathan A. (The Woodlands, TX)

Assignee: Compaq Computer Corporation

International Classification: G06F 1/20 (20060101); F28D 15/02 (20060101); H01L 23/34 (20060101); H01L 23/427 (20060101); H05K 7/20 (20060101); F28D 011/00 ()

Expiration Date: 07/03/2018