Patent Number: 6,253,902

Title: Electronic component supplying apparatus

Abstract: An electronic component supplying apparatus conveys electronic components in an aligned state to supply the same to a predetermined taking-out position. When a leading chip component abuts on a component stopper and a component conveyance is stopped, a plurality of the chip components including the leading chip component are covered in a non-contacting state by a slider, the leading chip component which has abutted on the component stopper is attracted to the component stopper. In a state where the component conveyance by the conveying path is stopped, the component stopper is displaced in a component conveying direction, the leading chip component is separated from a second leading chip component, and also the slider is displaced in a direction opposite to the component conveying direction, so that the slider covering is uncovered, and the leading chip component is allowed to be taken out.

Inventors: Saito; Koji (Tokyo, JP), Yasuda; Taro (Tokyo, JP)

Assignee: Taiyo Yuden Co., Ltd.

International Classification: H05K 13/02 (20060101); B65G 047/44 ()

Expiration Date: 07/03/2018