Patent Number: 6,253,985

Title: Unit for supplying solder balls

Abstract: A unit for supplying solder balls or the like is configured to have a primary hopper for storing a number of solder balls or the like, a ball tray for storing solder balls or the like, and a ball supply path connecting the primary hopper and the ball tray. A secondary hopper connected to the primary hopper through the ball supply path is provided near the ball tray. A vibration member is added to the secondary hopper, so that solder balls or the like are supplied to the ball tray by vibration.

Inventors: Kajii; Yoshihisa (Ishikawa, JP)

Assignee: Shibuya Kogyo Co., Ltd.

International Classification: B23K 3/06 (20060101); H01L 21/02 (20060101); H01L 21/48 (20060101); H01L 21/00 (20060101); H01L 21/60 (20060101); H05K 3/34 (20060101); B23K 037/00 (); B23K 001/00 (); B23K 005/00 ()

Expiration Date: 07/03/2018