Patent Number: 6,253,988

Title: Low temperature solder

Abstract: The present invention includes a low temperature solder composition having a mixture of elements including indium, tin and silver. Less than about 75% of the composition by weight is tin.

Inventors: Pereira; John (Rehoboth, MA)

Assignee: Antaya Technologies Corporation

International Classification: B23K 35/26 (20060101); B23K 031/02 (); C22C 028/00 ()

Expiration Date: 07/03/2018