Patent Number: 6,253,990

Title: Method for positioning the bond head in a wire bonding machine

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Inventors: Fogal; Rich (Boise, ID), Ball; Michael B. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/02 (20060101); H01L 21/00 (20060101); H01L 21/603 (20060101); B23K 031/02 ()

Expiration Date: 07/03/2018