Patent Number: 6,253,992

Title: Solder ball placement fixtures and methods

Abstract: Bonding material balls such as solder balls are applied onto contacts of a semiconductor chip or other microelectronic unit using an escapement mechanism which feeds one solder ball per cycle into each aperture of a stencil. The apparatus reliably places one solder ball on each contact of the microelectronic unit.

Inventors: Fjelstad; Joseph (Sunnyvale, CA)

Assignee: Tessera, Inc.

International Classification: B23K 3/06 (20060101); H01L 21/02 (20060101); H01L 21/48 (20060101); H01L 21/60 (20060101); H05K 3/34 (20060101); B23K 35/02 (20060101); B23K 035/12 (); B23K 001/00 (); B23K 035/14 ()

Expiration Date: 07/03/2018