Patent Number: 6,254,006

Title: Wireless communication devices and methods of forming wireless communication devices

Abstract: Wireless communication devices and methods of forming the same are described. In one implementation, an integrated circuitry transceiver chip and an antenna are operably coupled and mounted within a housing member. A cover(s) is (are) disposed over the chip and antenna and effectively seals the chip and antenna therewithin. In a preferred implementation, the chip, antenna, and a power source are mounted on a printed circuit substrate which is nestedly received by the housing member and effectively sealed therewithin by the cover. The housing member preferably includes structure which receives at least one of the chip and/or power source to provide a nested, compact device which can be carried by or upon a person. In one aspect, the housing member is formed from a material which does not meaningfully, if at all, degrade the electrical performance of the device. The cover(s) is preferably formed from the same material as the housing member to facilitate assembly of the device through bonding therebetween.

Inventors: Mish; William (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: G06K 19/077 (20060101); G06K 019/02 ()

Expiration Date: 07/03/2018