Patent Number: 6,254,090

Title: Vacuum control for vacuum holddown

Abstract: A mechanism for manifolding a vacuum force to separate surface sectors of a vacuum holddown uses subsurface ducting to apply the vacuum to separate subsurface vacuum plenums wherein each is fluidically coupled to a separate surface sectors. The plenum is segregated by a diaphragm into surface side and vacuum side cavities. Trigger ports and appropriate ducting through the holddown subjacent the surface associated with each sector determine how the vacuum is routed. Only when a trigger port is covered is the vacuum routed to the surface sector associated therewith. The system can be implemented in planar or curvilinear constructs and be provided with features to accommodate a near-continuous range of flexible material sizes. A specific implementation in an ink-jet hard copy apparatus is also described.

Inventors: Rhodes; John D. (Vancouver, WA), Rasmussen; Steve O. (Vancouver, WA), Chen; Angela (Portland, OR), Wotton; Geoff (Battleground, WA)

Assignee: Hewlett-Packard Company

International Classification: B41J 13/22 (20060101); B41J 11/00 (20060101); B65H 5/22 (20060101); G03G 15/00 (20060101); B65H 005/08 ()

Expiration Date: 07/03/2018