Patent Number: 6,254,429

Title: Surface-mount connector with high-degree flatness

Abstract: The connector comprises a housing (7) having a soldering portion (6, 15A or 15B) and a reinforcing metal member (5) movably attached to the housing such that it is vertically movable when it is soldered to a board (12). The reinforcing metal member is provided with a groove (14) to form with the solderable portion a gap between them, which permits soldering by capillary effects.

Inventors: Morita; Shigehiro (Tokyo, JP)

Assignee: Hirose Electric Co., Ltd.

International Classification: H05K 3/34 (20060101); H01R 013/60 (); H01R 013/66 ()

Expiration Date: 07/03/2018