Patent Number: 6,254,432

Title: Sealing structure in a sensor having lead wires

Abstract: A sealing structure for a sensor having lead wires, which comprises an electric element (2) provided with a plurality of lead wires (3, 4) and contained in a case (1), a rubber plug (5) inserted into an opening (8) in the case, the lead wires being guided out of the rubber plug through respective bores (13) formed therein, and a filling material (9) filled in the opening (8) above the rubber plug, the rubber plug (5) being provided with a partition wall (7) for providing a space between the lead wires (3, 4), the partition wall (7) being disposed in the filling material (9), whereby the lead wires (3, 4) are spaced from each other by the partition wall. A top end of the partition wall (7) may reach a level of a surface (9a) of the filling material (9). Lateral faces (7a) of the partition wall (7) may be in alignment with extension lines of inner faces of the bore (13). The partition wall (7) is integrally formed with the rubber plug (5), and formed of the same material as the rubber plug or a different resin material.

Inventors: Yoshigi; Toshimasa (Shizuoka, JP)

Assignee: Yazaki Corporation

International Classification: H01R 13/52 (20060101); H01R 013/58 ()

Expiration Date: 07/03/2018