Patent Number: 6,254,456

Title: Modifying contact areas of a polishing pad to promote uniform removal rates

Abstract: A polishing pad surface having a surface designed for chemical mechanical polishing of a substrate surface is described. The polishing pad surface includes a first area on the surface exposed to and capable of contacting a first amount of the substrate surface during chemical-mechanical polishing and a second area on the surface exposed to and capable of contacting a second amount of the substrate surface during chemical-mechanical polishing, wherein the second amount is larger than the first amount of the substrate surface to produce a more uniformly polished substrate surface.

Inventors: Kirchner; Eric J. (Troutdale, OR), Kalpathy-Cramer; Jayashree (West Linn, OR)

Assignee: LSI Logic Corporation

International Classification: B24B 37/04 (20060101); B24D 13/14 (20060101); B24D 13/00 (20060101); B24B 001/00 ()

Expiration Date: 07/03/2018