Patent Number: 6,254,460

Title: Fixed abrasive polishing pad

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished. Preferably, a portion of the second member can be removed from the polishing pad so that the first polishing surface extends beyond the second polishing surface to provide for a fixed amount of abrasion using the first member prior to the second member contacting the surface and substantially reducing or stopping the polishing process.

Inventors: Walker; Michael A. (Boise, ID), Robinson; Karl M. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: B24B 37/04 (20060101); B24B 7/22 (20060101); B24D 13/14 (20060101); B24D 11/00 (20060101); B24D 13/00 (20060101); B24B 7/20 (20060101); B24B 007/00 ()

Expiration Date: 07/03/2018