Patent Number: 6,254,465

Title: Method of machining wafer for making filmed head sliders and device for machining the same

Abstract: A filmed head slider, which is capable of writing data with high density, can be made by uniformly machining film layers formed on a wafer for making the filmed head sliders. The method of machining the wafer comprises the steps of: measuring curvature of the filmed surface of the wafer; selecting a machining plate having a machining face, whose curvature is in accord with that of the filmed surface of the wafer, on the basis of the result of the measuring step; and machining the filmed surface of the wafer with the selected ma chining plate.

Inventors: Gonda; Kazuhisa (Chungnam, KR), Sugiyama; Tomokazu (Kawasaki, JP), Suzuki; Kentaro (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: B24B 13/00 (20060101); B24B 13/02 (20060101); B24B 49/02 (20060101); B24B 37/04 (20060101); G11B 5/31 (20060101); B24B 029/00 ()

Expiration Date: 07/03/2018