Patent Number: 6,254,690

Title: Semiconductor wafer cleaning method using a semiconductor wafer cleaning device that supports a lower surface of the wafer

Abstract: Disclosed herein is a semiconductor wafer cleaning method using a semiconductor wafer cleaning device. The method includes providing a semiconductor wafer cleaning device with a back brush, bringing the back brush into contact with the entire lower surface of the semiconductor wafer, and cleaning an upper surface of the semiconductor wafer with a surface brush so as to clean the entire surface of the semiconductor wafer in an ever-horizontal state.

Inventors: Ueki; Koji (Tokyo, JP)

Assignee: Oki Electric Industry Co., Ltd.

International Classification: B08B 1/04 (20060101); H01L 21/00 (20060101); B08B 001/00 (); B08B 003/08 (); B08B 005/00 (); B08B 011/02 ()

Expiration Date: 07/03/2018