Patent Number: 6,254,720

Title: Wafer-processing apparatus

Abstract: A wafer-processing apparatus is provided which includes an container, a gas-supplying pipe, a pressure-leveling sensor, a controller, and an auto-cleaning device. The container is used for containing an processing solution. The gas-supplying pipe is used for supplying a gas into the container, wherein a pressure of the gas contained in the gas-supplying pipe is relative to a level of the processing solution. The pressure-leveling sensor connected to the gas-supplying pipe is used for detecting a pressure change of the gas contained in the gas-supplying pipe and correspondingly outputting a level signal. The controller electrically connected to the container and the pressure-leveling sensor is used for outputting a discharge signal to control the container to discharge the processing solution after a predetermined amount of wafers has been etched by the processing solution, and controlling an charge valve to charge the container with the processing solution in response to the level signal. The auto-cleaning device connected to the gas-supplying pipe and electrically connected to the controller and the pressure-leveling sensor is used for stopping the gas being supplied into the container, stopping the pressure-leveling sensor to output the level signal, and cleaning the gas-supplying pipe with a cleaning solution in response to the discharge signal, then, outputting a clean-stop signal to restart the gas being supplied into the container, to restart the pressure-leveling sensor to output the level signal, and to stop the cleaning of the gas-supplying pipe after a predetermined time.

Inventors: Shih; Pen-Chen (Yunlin, TW)

Assignee: Winbond Electronics Corp.

International Classification: B08B 9/02 (20060101); H01L 21/00 (20060101); B08B 003/00 (); B08B 007/00 ()

Expiration Date: 07/03/2018