Patent Number: 6,254,721

Title: Method and apparatus for processing samples

Abstract: Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.

Inventors: Kojima; Masayuki (Kokubunji, JP), Torii; Yoshimi (Tachikawa, JP), Hunabashi; Michimasa (Toda, JP), Suko; Kazuyuki (Tachikawa, JP), Yamada; Takashi (Niitsu, JP), Kuroiwa; Keizo (Ome, JP), Nojiri; Kazuo (Higashimurayama, JP), Kawasaki; Yoshinao (Yamaguchi, JP), Sato; Yoshiaki (Kudamatsu, JP), Fukuyama; Ryooji (Kudamatsu, JP), Kawahara; Hironobu (Kudamatsu, JP)

Assignee: Hitachi, Ltd.

International Classification: C23F 4/00 (20060101); H01L 21/02 (20060101); H01J 37/18 (20060101); H01L 21/67 (20060101); H01L 21/00 (20060101); H01L 21/677 (20060101); H01L 21/3213 (20060101); H01J 37/02 (20060101); H01L 021/306 ()

Expiration Date: 07/03/2018