Patent Number: 6,254,738

Title: Use of variable impedance having rotating core to control coil sputter distribution

Abstract: Variable reactances in an impedance-matching box for an RF coil, in a plasma deposition system for depositing a film of sputtered target material on a substrate, can be varied by rotating inductor cores during the deposition process so that the RF coil and substrate heating, and the film deposition, are more uniform due to "time-averaging" of the RF voltage distributions along the RF coil.

Inventors: Stimson; Bradley O. (San Jose, CA), Smyth; Kenneth (Santa Clara, CA), Gopalraja; Praburam (Sunnyvale, CA)

Assignee: Applied Materials, Inc.

International Classification: H01F 29/00 (20060101); H01J 37/32 (20060101); H01F 29/10 (20060101); H01J 37/34 (20060101); H03H 7/38 (20060101); C23C 014/34 ()

Expiration Date: 07/03/2018