Patent Number: 6,254,742

Title: Diffuser with spiral opening pattern for an electroplating reactor vessel

Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.

Inventors: Hanson; Kyle M. (Kalispell, MT), Weaver; Robert A. (Whitefish, MT), Simchuk; Jerry (Kalispell, MT), Thompson; Raymon F. (Kalispell, MT)

Assignee: Semitool, Inc.

International Classification: C25D 7/12 (20060101); C25B 009/00 (); C25C 007/00 (); C25D 017/00 ()

Expiration Date: 07/03/2018