Patent Number: 6,254,746

Title: Recessed coil for generating a plasma

Abstract: A recessed coil for a plasma chamber in a semiconductor fabrication system is provided. Recessing the coil reduces deposition of material onto the coil which in turn leads to a reduction in particulate matter shed by the coil onto the workpiece.

Inventors: Subramani; Anantha (San Jose, CA), Forster; John C. (San Francisco, CA), Stimson; Bradley O. (San Jose, CA), Edelstein; Sergio (Los Gatos, CA), Grunes; Howard (Santa Cruz, CA), Tepman; Avi (Cupertino, CA), Xu; Zheng (Foster City, CA)

Assignee: Applied Materials, Inc.

International Classification: H01J 37/32 (20060101); H01J 37/34 (20060101); C23C 014/34 ()

Expiration Date: 07/03/2018