Patent Number: 6,254,809

Title: System and method for curing a resin disposed between a top and bottom substrate with thermal management

Abstract: A system and method cure a combination of a top and a bottom substrate with a resin disposed in-between. A cure platform includes a chuck on which the combination rests. A cure device cures the resin. An actuation assembly separates the chuck from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.

Inventors: Parent; Scott R. (Saco, ME), Thibault; Thomas M. (Saco, ME), Parent; Donald G. (Windham, ME)

Assignee: Steag Hamatech, Inc.

International Classification: B29C 65/14 (20060101); B29C 65/00 (20060101); B29C 65/78 (20060101); G11B 7/26 (20060101); B29D 011/00 (); B29D 017/00 ()

Expiration Date: 07/03/2018