Patent Number: 6,254,827

Title: Methods for fabricating multi-component devices for molecular biological analysis and diagnostics

Abstract: A method for manufacturing a multicomponent flip-chip device is disclosed. The device includes a chip disposed adjacent to a substrate, the substrate including a via therethrough. The device is adapted to receive a fluid to be placed on the substrate, wherein the fluid then flows through the via down to the chip. The chip includes a sealant free region and a sealant receiving region. The method includes the steps of placing a chip adjacent to a substrate. Light is exposed to the substrate and through the via, down onto the surface of the chip. A light-curable, wickable sealant is applied to the interface between the substrate and the chip, wherein the light at least partially cures the sealant to preclude the sealant from flowing to the sealant free region. Additional curing of sealant may also be performed.

Inventors: Ackley; Donald E. (Cardiff, CA), LeClair; Timothy L. (San Diego, CA), Swanson; Paul D. (Santee, CA)

Assignee: Nanogen, Inc.

International Classification: B01L 3/00 (20060101); B01J 19/00 (20060101); C07B 61/00 (20060101); C07K 1/00 (20060101); C07K 1/04 (20060101); C07H 21/00 (20060101); C12Q 1/68 (20060101); F04B 19/00 (20060101); G01N 27/447 (20060101); G01N 27/403 (20060101); G01N 21/64 (20060101); G01N 33/543 (20060101); H01L 21/02 (20060101); G11C 13/02 (20060101); H01L 21/336 (20060101); H01L 21/70 (20060101); H01L 29/78 (20060101); G11C 19/00 (20060101); H01L 21/98 (20060101); H01L 29/66 (20060101); G01N 015/06 ()

Expiration Date: 07/03/2018