Patent Number: 6,254,958

Title: Photosensitive resin composition and articles

Abstract: The present invention aims to develop a photosensitive resin composition which exhibits a rapid ink absorption rate, which has an excellent water resistance, and which is appropriate for providing an ink receiving layer forming a sharp ink dot shape and having an excellent color formability of ink. A photosensitive resin composition forming an excellent ink receiving layer is obtained by incorporating at least one selected from an ethylenically unsaturated group-containing compound having quaternary nitrogen and a grain flour (filler) such as a wheat flour or the like in a photosensitive resin composition containing a quaternary nitrogen-free ethylenically unsaturated group-containing compound, a photopolymerization initiator etc.

Inventors: Yoshida; Kenji (Saitama-ken, JP), Tokuda; Kiyohisa (Saitama-ken, JP), Ishii; Kazuhiko (Saitama-ken, JP)

Assignee: Nippon Kayaku Kabushiki Kaisha

International Classification: B41M 5/52 (20060101); B41M 5/50 (20060101); C09D 4/00 (20060101); B41M 5/00 (20060101); B32B 009/02 ()

Expiration Date: 07/03/2018