Patent Number: 6,254,971

Title: Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device

Abstract: The invention provides resin-having metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a (sequentially) multilayered wiring board produced by using the resin-having metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means.

Inventors: Katayose; Teruo (Chiba, JP), Kinoshita; Shozo (Kanagawa, JP), Arai; Takeshi (Saitama, JP)

Assignee: Asahi Kasei Kabushiki Kaisha

International Classification: H01L 23/12 (20060101); H01L 23/14 (20060101); H05K 3/46 (20060101); H05K 1/03 (20060101); H05K 1/00 (20060101); H05K 1/02 (20060101); B32B 003/00 ()

Expiration Date: 07/03/2018