Patent Number: 6,254,972

Title: Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same

Abstract: A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.

Inventors: Farquhar; Donald S. (Endicott, NY), Papathomas; Konstantinos I. (Endicott, NY), Poliks; Mark D. (Vestal, NY)

Assignee: International Business Machines Corporation

International Classification: H05K 1/03 (20060101); H05K 3/38 (20060101); H05K 1/02 (20060101); B32B 003/00 ()

Expiration Date: 07/03/2018