Patent Number: 6,255,124

Title: Test arrangement and method for thinned flip chip IC

Abstract: According to one aspect of the disclosure, the present invention provides methods and arrangements for testing a flip chip semiconductor device after the back side of the chip has been thinned to expose a selected region in the substrate. For some chips, thinning removes substrate material useful for drawing heat away from the internal circuitry when the circuitry is running at high speeds. To compensate for this material loss, a special test fixture having a heat-dissipating device is arranged to draw heat from the device.

Inventors: Birdsley; Jeffrey D. (Austin, TX)

Assignee: Advanced Micro Devices

International Classification: G01R 31/28 (20060101); H01L 021/66 ()

Expiration Date: 07/03/2018