Patent Number: 6,255,135

Title: Quad flat pack integrated circuit package

Abstract: A quad flat pack (QFP) integrated circuit package that is modified to include a tab that increases the thermal efficiency of the package. The package contains an integrated circuit that is mounted to a die paddle of a lead frame. A plurality of leads extend from a first side of the die paddle. Placing all of the leads on one side of the package minimizes the difference in signal length between the leads. The tab extends from a second side of the die paddle. Both the leads and the tab extend from a plastic housing which encapsulates the integrated circuit. The tab provides a large conductive area which increases the heat transfer rate from the integrated circuit to the ambient, or an external thermal element.

Inventors: Barrow; Michael (El Dorado Hills, CA)

Assignee: Intel Corporation

International Classification: H01L 23/495 (20060101); H01L 23/48 (20060101); H01L 25/10 (20060101); H05K 1/18 (20060101); H05K 1/02 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 ()

Expiration Date: 07/03/2018