Patent Number: 6,255,136

Title: Method of making electronic package with compressible heatsink structure

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

Inventors: Alcoe; David James (Vestal, NY), Sathe; Sanjeev Balwant (Johnson City, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 23/367 (20060101); H01L 23/433 (20060101); H01L 23/34 (20060101); H01L 23/373 (20060101); H01L 23/40 (20060101); H01L 021/44 (); H01L 021/48 ()

Expiration Date: 07/03/2018