Patent Number: 6,255,138

Title: Process for producing microencapsulated electroconductive filler

Abstract: A process for producing a microencapsulated electroconductive filler comprising conductive filler particles each having an insulating resin coated on the surface thereof, which comprises: a first step of treating the surface of conductive filler particles with a coupling agent having reactive functional group A at a terminal end or in a side chain of its molecule; and a second step of allowing the coupling agent having functional group A present on the surface of the conductive filler particles to undergo nonaqueous polymerization reaction with a reactant B which is polymerizable with the functional group A, to thereby form an insulating resin layer on the surface of the conductive filler particles.

Inventors: Haishima; Takahiro (Tokyo, JP)

Assignee: Three Bond Co., Ltd.

International Classification: H01L 21/02 (20060101); H01L 21/60 (20060101); H05K 3/32 (20060101); H01L 021/44 ()

Expiration Date: 07/03/2018