Patent Number: 6,255,139

Title: Method for providing a thermal path through particles embedded in a thermal cap

Abstract: The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.

Inventors: Edwards; David L. (Poughkeepsie, NY), Coico; Patrick A. (Fishkill, NY), Iruvanti; Sushumna (Wappingers Falls, NY), Pompeo; Frank L. (Montgomery, NY), Sherif; Raed A. (Croton, NY), Toy; Hilton T. (Wappingers Falls, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 23/367 (20060101); H01L 23/42 (20060101); H01L 23/34 (20060101); H01L 23/373 (20060101); H01L 021/48 ()

Expiration Date: 07/03/2018