Patent Number: 6,255,140

Title: Flip chip chip-scale package

Abstract: A semiconductor flip chip chip-scale package that includes a metal heat slug bonded to the surface of a semiconductor chip. The heat slug protects the chip from being damaged as well as assists heat dissipation. Openings may also be formed on the heat slug to provide better air flow for cooling. A first packaging process for the chip-scale packages bonds a single heat slug to each semiconductor chip on a substrate panel. A second packaging process bonds a long heat slug comprising a plurality of connected heat slugs to the semiconductor substrate panel at the same time. Conventional packaging equipment can be used for both packaging processes to manufacture the chip-scale packages.

Inventors: Wang; Hsing-Seng (Tau-Yuan, TW)

Assignee: Industrial Technology Research Institute

International Classification: H01L 21/02 (20060101); H01L 21/67 (20060101); H01L 21/56 (20060101); H01L 23/498 (20060101); H01L 23/36 (20060101); H01L 23/48 (20060101); H01L 23/34 (20060101); H01L 21/60 (20060101); H01L 21/68 (20060101); H01L 23/00 (20060101); H01L 021/44 ()

Expiration Date: 07/03/2018