Patent Number: 6,255,141

Title: Method of packaging fuses

Abstract: Improved methods of packaging external fuses together with integrated circuit devices are described. A pair of frame strips are provided that each have an associated set of contact pads. A resistor paste is applied to one of the contact pad sets and the frame strips are laminated together by curing the resistor paste which is positioned between the contact pad sets. Dice are mounted to the opposite sides of the second contact pads to form integrated circuit devices having integrally packaged external fuses. The packaged devices are eventually singulated for use. In some embodiments, the contact pads each have downturned tabs that form wings on opposite sides of each die. When the dice are flip chips, a device may be attached to a substrate board by soldering both the bumps on the die and the tab wing tips to the substrate board. In a preferred embodiment, the resistor paste is a positive temperature coefficient resistor paste.

Inventors: Singh; Inderjit (San Jose, CA), Takiar; Hem P. (Fremont, CA), Mathew; Ranjan J. (San Jose, CA), Kelkar; Nikhil V. (Santa Clara, CA)

Assignee: National Semiconductor Corporation

International Classification: H01L 23/58 (20060101); H01L 23/62 (20060101); H01L 021/82 ()

Expiration Date: 07/03/2018