Patent Number: 6,255,142

Title: Method for underfilling semiconductor devices

Abstract: A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.

Inventors: Babiarz; Alec J. (Encinitas, CA), Bouras; Carlos Edward (Encinitas, CA), Cursi; Drusilla Bertone (Encinitas, CA), Lewis; Alan Ray (Carlsbad, CA), Vint; Jason Thomas (La Mesa, CA)

Assignee: Nordson Corporation

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 21/00 (20060101); H01L 021/44 ()

Expiration Date: 07/03/2018