Patent Number: 6,255,196

Title: Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Inventors: Akram; Salman (Boise, ID), Gochnour; Derek J. (Boise, ID), Hess; Michael E. (Kuna, ID), Hembree; David R. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: B28D 5/00 (20060101); B28D 5/02 (20060101); H01L 021/30 (); H01L 021/46 ()

Expiration Date: 07/03/2018