Patent Number: 6,255,208

Title: Selective wafer-level testing and burn-in

Abstract: Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.

Inventors: Bernier; William Emmett (Endwell, NY), Bertin; Claude Louis (South Burlington, VT), Bhatt; Anilkumar Chinuprasad (Johnson City, NY), Gaynes; Michael Anthony (Vestal, NY), Hedberg; Erik Leigh (Essex Junction, VT), Murdeshwar; Nikhil M. (Abington, PA), Pierson; Mark Vincent (Binghamton, NY), Tonti; William R. (Essex Junction, VT), Totta; Paul A. (Poughkeepsie, NY), Van Horn; Joseph John (Underhill, VT), Zalesinski; Jerzy Maria (Essex Junction, VT)

Assignee: International Business Machines Corporation

International Classification: H01L 21/02 (20060101); H01L 21/60 (20060101); H01L 021/44 ()

Expiration Date: 07/03/2018