Patent Number: 6,283,693

Title: Method and apparatus for semiconductor chip handling

Abstract: For stripping selected chips from a wafer of diced chips adhered, bottom surface down, to a flexible, elastic membrane, the bottom surface of the membrane is disposed against an apertured plate of a vacuum chuck for firmly holding the membrane in place with a group of the chips directly overlying push-up pins vertically movable through slots through the apertured plate. Selected pins are fired upwardly with sufficient speed to dislodge struck chips, but not non-selected adjacent chips, off the membrane and to hurl them, in free flight, upwardly against an overlying chip catching member. The stripped and caught chips are then transferred for storage or use.

Inventors: Acello; Salvatore (St. James, NY), Ansinn; Detlev (Warrington, PA)

Assignee: General Semiconductor, Inc.

International Classification: H01L 21/683 (20060101); H01L 21/67 (20060101); H01L 21/00 (20060101); B32B 035/00 ()

Expiration Date: 09/04/2018