Patent Number: 6,293,139

Title: Method of determining performance characteristics of polishing pads

Abstract: A testing and analyzing method for determining the performance characteristics of a production lot of polishing pads. The first step requires polishing a plurality of semiconductor wafers with a selected number of polishing pads from the production lot of polishing pads. At least a portion of the surface area of each of the plurality of semiconductor wafers is divided into a plurality of sites. At least one wafer characteristic from each site is measured. The wafer characteristic from each site is incorporated into a discriminant function selected to predict the performance characteristics of a production lot of polishing pads by the quantitative level of the data obtained from a plurality of semiconductor wafers polished by the selected number of polishing pads.

Inventors: Keller; Kevin A. (St. Charles, MO), Whitman, Jr.; Gerald A. (O'Fallon, MO)

Assignee: MEMC Electronic Materials, Inc.

International Classification: B24B 49/00 (20060101); B24B 37/04 (20060101); H01L 21/66 (20060101); G01B 005/28 (); B23Q 017/09 (); G01N 003/56 ()

Expiration Date: 09/25/2018