Patent Number: 6,293,455

Title: Method for producing a reliable BGA solder joint interconnection

Abstract: A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Inventors: Caletka; David V. (Apalachin, NY), Knadle; Kevin (Vestal, NY), Woychik; Charles G. (Vestal, NY)

Assignee: International Business Machines Corporation

International Classification: B23K 3/08 (20060101); B23K 3/00 (20060101); H05K 1/02 (20060101); H05K 3/34 (20060101); B23K 031/12 (); G01K 013/06 ()

Expiration Date: 09/25/2018