Patent Number: 6,294,741

Title: Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive

Abstract: A multi-chip electronics module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

Inventors: Cole, Jr.; Herbert Stanley (Burnt Hills, NY), Sitnik-Nieters; Theresa Ann (Clifton Park, NY)

Assignee: Lockheed Martin Corporation

International Classification: H01L 21/02 (20060101); H01L 23/52 (20060101); H01L 23/28 (20060101); H01L 21/58 (20060101); H01L 21/70 (20060101); H01L 23/29 (20060101); H01L 23/538 (20060101); H01L 21/98 (20060101); H05K 3/46 (20060101); H05K 3/38 (20060101); H05K 001/16 ()

Expiration Date: 09/25/2018