Patent Number: 6,294,742

Title: Apparatus and method for adapting surface mount solder pad for heat sinkfunction

Abstract: A surface mount solder pad that is adapted to function as a heat sink foran electronic component soldered to the pad. Included is a printed wiringboard having solder pads disposed on its surface that are adapted forsoldering to leads of surface mount components. The solder pads areelectrically interconnected by conductive traces also disposed on thesurface. At least one of the solder pads has an enhanced surface area thatis selected larger than necessary for the soldering, and that is selectedsufficiently large so as to sink enough heat generated by one of thesurface mount components to provide for its proper operation.

Inventors: Ziemkowski; Ted B (Loveland, CO)


International Classification:

Expiration Date: 09/25/2013